Researchers at Sichuan University, led by Professor Hua Deng, have developed an innovative method to enhance the thermal conductivity of polymer composites by integrating liquid metal fillers. Published in the Chinese Journal of Polymer Science, the study presents a technique called "shear-induced precipitation-interfacial reset-reprotonation," which successfully stabilizes liquid metal within the polymer matrix, achieving a remarkable 126.8% increase in thermal conductivity compared to conventional composites. The resulting aramid micron fibers-liquid metal (AMFs-pH/LM) films not only demonstrate excellent heat dissipation with a thermal conductivity of 10.98 W·m−1·K−1, but also maintain strong mechanical properties, making them ideal for high-power electronics applications. This advancement opens new avenues for effective thermal management in various industries, including flexible electronics and high-power LED lighting, while promising more sustainable material solutions in technology.
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